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Driver Integrated 10Gb/s MI-DFB LD Module
FEATURES
* Driver integrated 10Gb/s MI-DFB module for 1600ps/nm optical transmission * MI-DFB-LD (Modulator Integrated DFB Laser Diode) is installed * Modulator driver IC is installed * Built-in optical isolator, PIN-Photo diode for monitor, thermistor and thermo-electric cooler * 1600ps/nm (80km)
FTM1141GF-C
DESCRIPTION
The FTM1141GF-C was developed to reduce the size and technical complexity of 10Gb/s optical board designs. This product, which includes a driver and modulator integrated laser in one package, eliminates the customer concerns regarding how to handle the RF interfacing between these two components on his board. By co-packaging these components a solution has also been achieved that offers greatly reduced board space. This reduction in space is critical for next generation transponder applications. The FTM1141GF-C has been designed with a differential co-planar electrical interface which allows for easy interfacing to RF lines on PC boards. The package and pinout are part of a multi-source agreement. This product is designed for 80km SONET/SDH applications and single channel drop links in DWDM systems. ABSOLUTE MAXIMUM RATINGS (Top=25C, Unless otherwise specified)
Parameter Storage Temperature Operating Case Temperature Optical Output Power Laser Forward Current Laser Reverse Voltage Power Supply Voltage Modulator (Mod) Modulation Control Voltage Mod Bias Control Voltage Cross Point Control Voltage Data Input Voltage ESD Tolerance ESD Tolerance Photodiode Forward Current Photodiode Reverse Voltage TEC Voltage TEC Current Thermistor Temperature Lead Soldering Time Symbol Tstg Top(Tc) Pf If VR Vss Vm Vb Vx1,(Vx2) Din, DinB Vesd Vesd VDR Vc Ic Tth Cooling Heating Cooling Heating ATC operation 260C MAX Differential (AC-coupled) Note (1-1) Note (1-2) CW CW CW Condition Limits Min. -40 0 -6.5 -6.5 -6.5 Vss-4.8 (min-6.5) -1.0 -0.5 0 Max. 85 75 5 150 2 0 Vss+1.2 (max0) Vss+2.4 (max0) Vss+2.4 (max0) 1.6 50 200 1 10 2.5 1.5 +75 10 Unit C C mW mA V V V V V Vpp V V mA V V A C sec
Edition 1.1 July 2004
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FTM1141GF-C
LASER DIODE AND MODULATOR CHARACTERSITICS
Parameter Threshold Current Operating Current Optical Output Power Forward Voltage Extinction Ratio Peak Wavelength Side Mode Suppresion Ratio Optical Rise Time Optical Fall Time Optical Isolation Tracking Error Input Return Loss Dispersion Penalty Eye Pattern Mask Symbol Ith Iop Pop VF Rext Wp SSR Tr Tf Is TE S11 dP Msk Note (2a) Condition CW Pf=Pop Note (2a) CW, IF=Iop
Driver Integrated 10Gb/s MI-DFB LD Module
Limit Typ. 70 1.4 Error Free
OPTICAL SPECIFICATIONS (TLD=25C, Top=0 to 75C and BOL, unless otherwise specified)
Min. 40 +1.0 9.0 1530 35 25 -0.5 6 Max. 25 100 +3.5 2.2 1565 30 30 +0.5 2.0 Unit mA mA dBm V dB nm dB psec psec dB dB dB dB -
Pf=Pop, Note (2a) Pf=Pop, Note (2a) IF=Pop, CW Note (3), 20% to 80% Note (3), 20% to 80%
130KHz to 10GHz Note (2) Note (2a), 500 counts
MONITOR DIODE CHARACTERISTICS
Parameter Monitor Current Monitor Dark Current Monitor Diode Capacitance Symbol Im Id Ct Condition IF=Iop, VDR=5V VDR=5V VDR=5V, f=1MHz Min. 100 Limit Typ. 2 5 Max. 1500 100 15 Unit A nA pF
TEC & THERMISTOR CHARACTERISTICS
Parameter TEC Current TEC Voltage TEC Power Consumption Thermistor Resistance Thermistor B Constant Symbol Ic Vc Pc Rth B Condition Note (4) Note (4) Note (4) TLD=25C 25/75C Min. 3270 Limit Typ. 10 3450 Max. 1.0 2.0 2.0 3630 Unit A V W k K
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Driver Integrated 10Gb/s MI-DFB LD Module
DRIVER IC CHARACTERISTICS
Parameter Driver IC Supply Voltage Driver IC Supply Current Modulator (Mod) Modulation Control Voltage Mod Bias Control Voltage Cross Point (XP) Control Voltage Data Input Voltage Symbol Vss Iss Vm Vb Vx1, (Vx2) Din, DinB Xp=50% Differential (AC Coupled) Condition
FTM1141GF-C
Limit Typ. -5.2 Unit V mA V V V Vpp
Min. -5.5 Vss Vss Vss +0.8 0.5
Max. -4.9 285 Vss +1.0 Vss +2.2 Vss +2.2 1.0
Note (1-1): Pin No. 3,4,5,6,7,9,11 (Human Body Model) Note (1-2): Pin No. 1,2,8,10,12-19 (Human Body Model) Note (2): Eudyna Test System (a) Drive Condition Bit Rate: 9.95328 Gb/s Word Pattern: PRBS=231-1 Mark Density: 50% Laser Bias Current: Iop Laser Temperature(TLD): 25C Eye Pattern Mask: ITU-T Eye mask for STM-64 (b) Fiber Dispersion 1600ps/nm (c) Dispersion Penalty Bit Error Rate=10-12 Note (3): Eudyna Test System Vb, Vm, Vx1(Vx2) is set to make Pop and Rext within the specification Note (4): Eudyna Test System Operating Case Temperature: Top=+75C Laser Temperature: 25C Optical Output Power: Pf=Pop, Note (2a)
Typical Output Waveform
Back to Back (with Filter)
9.95328Gb/s, NRZ, PRBS=231-1, TLD=TC=25C
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FTM1141GF-C
Driver Integrated 10Gb/s MI-DFB LD Module
Typical Application for Driver IC
Supply Voltage Modulation Voltage Control Bias Voltage Control
Cross Point Control
Chip Capacitor 0.1F Ther r TEC
Chip Capacitor 0.1F
Vx1 GND DinB Blocking Capacitor Ex. 0.1F GND Din GND
Vx2
VSS
Vm
Vb
GND
PD
PD
LD
NC
NC
TEC
For stable operation:
8-1. To prevent a dependence of "Cross point" on the supply voltage VSS, (1) Use an external voltage source of -3.8V for "Vx2", or (2) Control the voltage of "Vx1", so that the voltage difference "Vx1-Vx2" remain constant. 8-2. To prevent a dependence of "Modulation control voltage" on the supply voltage VSS, control the voltage of "Vm", so that the difference "Vm-VSS" remain constant. 8-3. To prevent a dependence of "Bias control voltage" on the supply voltage VSS, control the voltage of "Vb", so that the difference "Vb-VSS" remain constant.
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Driver Integrated 10Gb/s MI-DFB LD Module
"GF" PACKAGE
14-0.2 7 1 O5.200.25 0.5
FTM1141GF-C
4.860.20
UNIT: mm
351
8 22.0 18.0 12.0 5.3
12
4-O2.60.2 13 9.6 19 7.7
Detail B
Detail A
13.6 17.6 L (3) 25.00.5 4.56
O0.90.1
1.25
5-0.150.08
4.95
Pin Description
1. Thermoelectric cooler(Anode, +) 2. Thermistor 3. Vb: Modulator bias control voltage 4. Vm: Modulator modulation voltage control voltage 5. Vss: Driver IC supply voltage 6. Vx2: Cross point control voltage 7. Vx1: Cross point control voltage 8. Case Ground 9. DinB: Inverted data input voltage 10. Case Ground 11. Din: Data Input voltage 12. Case Ground 13. Monitor photo diode(Cathode) 14. Monitor photo diode(Anode) 15. Case Ground 16. LD Bias(Anode) 17. NC 18. NC 19. Thermoelectric cooler(Cathode, -)
4.460.20
3.56
1.25 CONNECTOR 4-P1.0
NOTE: Pigtail length (L) shall be specified in the detail (individual) specification.
14-0.3 4.000.25 6.000.25 5-0.3 DETAIL-A DETAIL-B
5.8 12-P1.0
For further information please contact:
CAUTION
Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures:
Eudyna Devices USA Inc.
2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: (408) 232-9500 FAX: (408) 428-9111
www.us.eudyna.com
* Do not put this product into the mouth. * Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. * Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures.
Eudyna Devices Europe Ltd.
Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888
Eudyna Devices Asia Pte Ltd. Hong Kong Branch
Rm. 1101, Ocean Centre, 5 Canton Rd. Tsim Sha Tsui, Kowloon, Hong Kong TEL: +852-2377-0227 FAX: +852-2377-3921
Eudyna Devices Inc. reserves the right to change products and specifications without notice. The information does not convey any license under rights of Eudyna Devices Inc. or others.
(c) 2004 Eudyna Devices USA Inc. Printed in U.S.A.
Eudyna Devices Inc.
Sales Division 1, Kanai-cho, Sakae-ku Yokohama, 244-0845, Japan TEL: +81-45-853-8156 FAX: +81-45-853-8170
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